BMH20C, BMH20E nRF54H20 Bluetooth 6.0 Thread, Zigbee Modules

We are withdrawing our nRF54H20-based module, the BMH20, to align with Nordic's decision to focus the nRF54H20 SoC on a selected set of customers and applications. For the broader market, we will continue our focus on the nRF54L Series-based modules, BM20 and BM15. Customers with an existing or planned BMH20 project are encouraged to contact Fanstel. We will help assess the application requirements and identify the most appropriate Fanstel module solution.

No External Component Required, Minimum Host PCB Area

BMH20C is a Nordic nRF54H20 BLE 6.0 module with a dualcore Cortex M33 MCUs at up to 320MHz and a dualcore RISC-V at up to 320 MHz. Both 32 MHz and 32.768 KHz, -40C to +105C, 20PPM crystals are integrated. Host PCB area is minimized without needing an external component.

Module Summaries

BMH20C

• Size 10x14.8x2mm

• High performance chip antenna.

BMH20E

• Size 10x15x2mm

• an u.FL connector for external antenna.

BMH20XE

• Size 10x24x2mm

• with a Skyworks SKY66403 power amplifier.

• A chip antenna and a u.FL connector for external antenna.

BMH20C Specifications:  

BLE 6.0, IEEE 802.15.4-2006 Transceiver

• Complete RF solution with integrated antenna

• BLE: 2Mbps, 1Mbps, 500kbps, 125kbps.

• IEEE 802.15.4-2006: 250 kbps.

• Proprietary: 4Mbps, 2Mbps, 1Mbps.

• Programmable TX power, +10 dBm.

• AoA and AoD direction finding using BLE.

Platform Security

• PSA Level 3.

• Secure Boot, Secure firmware Update, and Secure Storage.

• Root of Trust and Physically Uncloneable Function (PUF).

• Cryptographic accelerators hardened against side-channel attacks.

• Tamper detection.

Application processor

• ARM Cortex M33, 320MHz.

• 32 KB tightly coupled RAM.

• Dynamic Voltage-Frequency Scaling (DVFS)

• TrustZoneR FPU, DSP.

Radio processor

• ARM Cortex M33, 256MHz.

• 192 KB tightly coupled RAM.

• TrustZoneR FPU, DSP.

Co-processor

• 320MHz, RiSC-V with 64 KB of tightly coupled RAM.

• 16 MHz RISC-V with 64 KB of tightly coupled RAM.

Memory

• 2MB non-volatile M-RAM, 2 independent banks.

• 768 KB RAM.

• External memory interface, XiP-capable, supporting QSPI, xSPI, HyperBus, up to 400 MB/s.

Peripherals

• High-speed USB (480 Mbps).

• CAN FD controller

• 2 x I3C

• Audio PLL, 2 x TDM, PDM.

• 8 x SPI/TWI/UART.

• 14-bit ADC, COMP and LPCOMP.

• NFC.

• 2 x High speed timer and 8 x timer, Global RTC.

• SIMIF (ISO 7816-compatible interface to smart cards).

• 2 x QDEC.

• 64 GPIOs.

• 90 LGA pins.   

• 1.8V and 3.3V supply voltage.

• Operation temperature: -40°C to +105°C

Applications

• Advanced wearables

• Smart home and Matter

• Medical and healthcare

• LE Audio

• Industrial

• Gaming

• Virtual reality and augmented reality

• E-mobility 

Certifications

• FCC ID:

• ISED ID:

• Europe:

• Australia and New Zealand:

• Japan TELEC:

• QDID:

• Availability:

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For volume discount and production lead time, please email Fanstel.